Radeon R5 M335 

Pascal is the name we've all being hearing about, and along with this next-gen core we've been expecting HBM2 (second-gen High Bandwidth Memory).

We are expecting news of the next NVIDIA graphics card this spring, and as usual whenever an announcement is imminent we have started seeing some rumors about the next GeForce card.

Another key enabler of the Core M processor is the use of 2nd generation FIVR and 3DL for power efficiency delivery.

There’s a small section dedicated to the memory and I/O controllers at the bottom of the die while along the right side, we can note the system agent, display engine and memory controller.

When it comes to building and configuring Core M, Intel likes to refer to their efforts as the “Fanless Challenge,” reflecting the fact that their biggest goal with Core M is to comfortably get the processor in to 10” tablets under 10mm in thickness that are passively cooled.

The end result no doubt limited what performance optimizations Intel could integrate into Broadwell’s design, but it also functionally reduces power requirements for any given performance level, furthering Intel’s goals in getting Core performance in a mobile device.

However, the increased focus on power optimization through software tools can help Apple gain a good standby time.

Apple’s next-gen iPhone is expected to be launched in two variants of larger display sizes: a 4.7-inch iPhone 6 and another 5.5-inch iPhone 6 sapphire display phone.