| || |
6.1 Out of 10
by hassan-mujtaba (Sep, 2014)
Intel is so much focused on the power output of the Core M die that they even designed a new PCH known as Broadwell PCH-LP which is focused on power.
by Shaikh-Rafia (Jul, 2014)
Apple’s next-gen iPhone is expected to be launched in two variants of larger display sizes: a 4.7-inch iPhone 6 and another 5.5-inch iPhone 6 sapphire display phone.
GPUBoss Review Our evaluation of the Radeon R5 M335 among Laptop GPUs
Benchmarks Real world tests of the Radeon R5 M335
In The News From around the web
by Sebastian Peak |
Pascal is the name we've all being hearing about, and along with this next-gen core we've been expecting HBM2 (second-gen High Bandwidth Memory). We are expecting news of the next NVIDIA graphics card this spring, and as usual whenever an announcement is imminent we have started seeing some rumors about the next GeForce card.
Another key enabler of the Core M processor is the use of 2nd generation FIVR and 3DL for power efficiency delivery. There’s a small section dedicated to the memory and I/O controllers at the bottom of the die while along the right side, we can note the system agent, display engine and memory controller.
by Ryan Smith |
When it comes to building and configuring Core M, Intel likes to refer to their efforts as the “Fanless Challenge,” reflecting the fact that their biggest goal with Core M is to comfortably get the processor in to 10” tablets under 10mm in thickness that are passively cooled. The end result no doubt limited what performance optimizations Intel could integrate into Broadwell’s design, but it also functionally reduces power requirements for any given performance level, furthering Intel’s goals in getting Core performance in a mobile device.
by Shaikh Rafia |
However, the increased focus on power optimization through software tools can help Apple gain a good standby time. Apple’s next-gen iPhone is expected to be launched in two variants of larger display sizes: a 4.7-inch iPhone 6 and another 5.5-inch iPhone 6 sapphire display phone.
Specifications Full list of technical specs
|Clock speed||1,070 MHz|
|Turbo clock speed||825 MHz|
|Is dual GPU||No|
|Texture mapping units||20|
|Render output processors||8|
|Pixel rate||8.56 GPixel/s|
|Texture rate||21.4 GTexel/s|
|Floating-point performance||684.8 GFLOPS|
|Memory clock speed||900 MHz|
|Effective memory clock speed||1,800 MHz|
|Memory bus||64 bit|
|Memory bandwidth||14.4 GB/s|
Report a correction